Numerical analysis of the formation of coined solder bumps

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 388-392

  Hwang, Tae Kyung ^a   Lee, Soon Bok ^a   Nah, Jae Woong ^a   Paik, Kyung Wook ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD; MODIFIED ATMOSPHERE PACKAGING; NUMERICAL ANALYSIS; PACKAGING MATERIALS;

COINING PROCESS; OPTIMAL EXPERIMENTS; PROCESS TEMPERATURE; PROCESS TIME; PROCESS VARIABLES; SOLDER MATERIAL; TEMPERATURE VARIATION; TEMPERATURE-DEPENDENT MATERIAL;

TIN;

EID: 84960467596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.984015     Document Type: Conference Paper

References (7)

1. rd International Symposium on Electronic Materials and Packaging (EMAP2001), Jeju, Korea., 2001.
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3. X. Q. Shi, W. Zhou, H. L. J. Pang and Z. P. Wang, "Temperature and Strain Rate Effect on Mechanical Properties of 63Sn/37Pb Solder Alloy", Proc Advanced in Electronic Packaging (InterPACK'99), Hawaii, June. 1999, EEP-Vol. 26-1, pp. 551-557
4. Lan Hong Dai and Shi-Wei Ricky Lee, "Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy", Proc IPACK'01(InterPACK'01), Hawaii, June. 2001, IPACK2001-15553
5. Wenge Yang, Lawrence E. Felton and Robert W. Messler Jr., "The Effect of Soldering Process Variables on the Microstructure and Mechanical Properties of Eutectic Sn-Ag/Cu Solder Joints", J. of Elec. Mat., Vol. 24, No. 10 (1995), pp. 1465-1472
6. Ryuji Ninomiya, Koichi Miyake and Junichi Matsunaga, "Microstructure and Mechanical Properties of New Lead-Free Solder", Proc Advanced in Electronic Packaging (InterPACK'97), Hawaii, June. 1997, EEP-Vol. 19-2, pp. 1329-1333
7. R. W. Neu, D. T. Scott and M. W. Woodmansee, "Thermomechanical Behavior of 96Sn-4Ag and Castin Alloy", Trans. of the ASME J. of Elec. Pack., Vol. 123, No. 4 (2001), pp. 238-246