Effect of heat treatment on the interfacial adhesion strength between Sn-Zn-xAg lead-free solders and Cu substrate

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 216-218

  Chang, Tao Chih ^a   Hon, Min Hsiung ^a   Chang, Chin Hui ^b   Wang, Moo Chin ^b  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

^b NATIONAL KAOHSIUNG UNIVERSITY OF APPLIED SCIENCES   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BOND STRENGTH (MATERIALS); CHIP SCALE PACKAGES; ELECTRONICS PACKAGING; INTERFACES (MATERIALS); INTERMETALLICS; LEAD; LEAD-FREE SOLDERS; MODIFIED ATMOSPHERE PACKAGING; OXIDATION RESISTANCE; PACKAGING MATERIALS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS; WETTING; X RAY DIFFRACTION; ZINC;

DISTRIBUTION OF ELEMENT; EFFECT OF HEAT TREATMENTS; ELECTRONIC PACKAGING INDUSTRY; ENERGY DISPERSIVE SPECTRUM (EDS); EUTECTIC SOLDERS; FRACTURE MORPHOLOGY; INTERFACIAL ADHESION STRENGTH; PULL-OFF TESTS;

TIN;

EID: 84960448399     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983987     Document Type: Conference Paper

References (9)

1. S. P. Yu, M. H. Hon, and M. C. Wang, J. Elec. Mater., Vol. 29, No. 2 (2000), pp. 237-243.
2. S. P. Yu, M. C. Wang and M. H. Hon, J. Mater. Res., Vol. 16, No. 1 (2001), pp. 76-82.
3. M. McMcormack, S. Jin, JOM, July, 1993, pp. 36-40.
4. M. McMcormack, S. Jin, J. Elec. Mater. Vol. 23, No. 7 (1994), pp. 635-640.
5. E. P. Wood, K. L. Nimmo, J. Elec. Mater., Vol. 23, No. 8 (1994), pp. 709-713.
6. S. Vaynman, M. E. Fine, Scripta Materialia, Vol. 41, No. 12 (1999), pp. 1269-1271.
7. M. E. Loomans, S. Vaynman, G. Ghosh, M. E. Fine, J. Elec. Mater., Vol. 23, (1997), p. 741.
8. J. P. Lucas, A. W. Gibson, K. N. Subramanian, T. R. Bieler, Proc. MRS Spring Meeting, 522 (Warrendale, PA: MRS, 1998), p. 339.
9. K. Suganuma, Y. Nakamura, J. Jpn. Inst. Metals, Vol. 59 (1995) , pp. 1299-1305.