A novel approach to incorporate silica filler into no-flow underfill

Advances in Electronic Materials and Packaging 2001

Volumn , Issue , 2001, Pages 24-28

  Zhang, Zhuqing ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DESIGN OF EXPERIMENTS; ELECTRONICS PACKAGING; FACINGS; FLIP CHIP DEVICES; MODIFIED ATMOSPHERE PACKAGING; ORGANIC POLYMERS; SILICA; SUBSTRATES; THERMAL EXPANSION; WETTING;

FLIP CHIP ASSEMBLIES; ITS APPLICATIONS; MICROSCOPIC OBSERVATIONS; NO-FLOW UNDERFILL; POLYMER MATERIALS; SOLDER INTERCONNECT; SOLDER WETTING; UNDERFILL TECHNOLOGY;

FILLERS;

EID: 84960395879     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2001.983952     Document Type: Conference Paper

References (12)

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12. Z. Zhang, J. Lu, C.P. Wong, Provisional Patent 60/288,246: "A Novel Process Approach to Incorporate Silica Filler into No-Flow Underfill", 5-2-2001.