Influence of surface contamination on metal/metal bond contact quality

Journal of Electronic Materials

Volumn 27, Issue 8, 1998, Pages 990-997

  Schneuwly, A ^a   Groning P ^a   Schlapbach, L ^a   Jaecklin, V P ^b  

^a Institute of Physics   (Switzerland)

^b Oerlikon Assembly Equipment AG   (Switzerland)

Author keywords

Ag plated Cu lead frames; Al bond pads; Au wire bonding; Au Ni coated multichip material (MCM); Plasma cleaning; Surface contamination; X ray photoelectron spectroscopy (XPS)

Indexed keywords

EID: 0003314746     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0132-1     Document Type: Article

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