Fabrication and characterization of AlN/PTFE composites with low dielectric constant and high thermal stability for electronic packaging

Journal of Materials Science: Materials in Electronics

Volumn 27, Issue 1, 2016, Pages 286-292

  Pan, Chen ^a   Kou, Kaichang ^a   Wu, Guanglei ^a,b   Zhang, Yu ^a   Wang, Yiqun ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

^b XI'AN JIAOTONG UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC LOSSES; ELECTRONICS PACKAGING; THERMODYNAMIC STABILITY;

ALUMINUM NITRIDE (ALN); ELECTRONIC PACKAGING; FABRICATION AND CHARACTERIZATIONS; HIGH THERMAL STABILITY; LOW DIELECTRIC CONSTANTS; POWDER PROCESSING TECHNIQUES; SCANNING ELECTRON MICROSCOPIC; SMALL VARIATIONS;

ALUMINUM NITRIDE;

EID: 84954373407     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-015-3752-2     Document Type: Article

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