Failure analysis for the 0.13 μm Cu/low k (Black Diamond™) interconnection by the passive voltage contrast

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 342-345

  Li, Hongyu ^a   Su, Yong Jie ^a   Tsang, Chi Fo ^a   Patrick, Y W C ^a   Koh, Mei Ling ^a   Wong, Lai Yin ^a   Tang, Leijun ^a   Li, Wei Hong ^a   Chang, Chang Kuo ^a   Bliznetsov, V ^a   Lin, Z ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHAINS; ELECTRONICS PACKAGING; HEAT TREATMENT; INTEGRATED CIRCUIT INTERCONNECTS; POLYVINYL CHLORIDES; SCANNING ELECTRON MICROSCOPY; VOLTAGE MEASUREMENT;

CU/LOW-K; DUAL DAMASCENE; PASSIVE VOLTAGE CONTRASTS; VIA CHAIN; VOLTAGE CONTRAST;

FAILURE ANALYSIS;

EID: 84954043166     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271542     Document Type: Conference Paper

References (3)

1. Katherine Derbyshire, "COPPER INTERCONNECTS FACE FAB REALITIES," SEMICONDUCTOR MAGAZINE, November 2001 Vol.2, No.11.
2. th IPFA 2001 Conf, Singapore, pp. 36-41.
3. th IPFA 2001 Conf, Singapore, pp. 107-111.