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4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing, Proceedings - Presented at Adhesives in Electronics 2000

Volumn , Issue , 2000, Pages 212-215

Electric field effects in the production of ICA joints

(2) Heuschkel, M D a Morris, J E b

a CHEMNITZ UNIVERSITY OF TECHNOLOGY (Germany)

b State University of New York at Binghamton (United States)

Author keywords

Assembly; Conductive adhesives; Curing; Electric resistance; Environmentally friendly manufacturing techniques; Independent component analysis; Lead; Production; Silver; Surface resistance

Indexed keywords

ADHESIVES; ASSEMBLY; COATINGS; CURING; ELECTRIC FIELDS; ELECTRIC RESISTANCE; INDEPENDENT COMPONENT ANALYSIS; JOINING; LEAD; LEAD-FREE SOLDERS; MANUFACTURE; PRODUCTION; SILVER; SOLDERING ALLOYS; SURFACE RESISTANCE;

ASSEMBLY PROCESS; CONDUCTIVE ADHESIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; ELECTRONIC DEVICE; LEAD-FREE SOLDER ALLOY; MANUFACTURING TECHNIQUES;

ELECTRIC FIELD EFFECTS;

EID: 84952360130 PISSN: None EISSN: None Source Type: Conference Proceeding
DOI: 10.1109/ADHES.2000.860602 Document Type: Conference Paper

Times cited : (2)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.