Mathematical modelling: A laser soldering process for an optoelectronics butterfly package

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 121-127

  Gwyer, D ^a   Bailey, C ^a   Pericleous, K ^a   Philpott, D ^b   Misselbrook, P ^b,c  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b Celestica   (United Kingdom)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Costs; Diode lasers; Fiber lasers; Laser modes; Mathematical model; Optical fiber cables; Optical fiber devices; Packaging; Soldering; Thermal stresses

Indexed keywords

CABLES; CHIP SCALE PACKAGES; COSTS; DIODES; FIBER LASERS; FIBERS; ITERATIVE METHODS; LASER MODES; MATHEMATICAL MODELS; OPTICAL CABLES; OPTICAL FIBER COMMUNICATION; OPTICAL FIBERS; PACKAGING; SEMICONDUCTOR LASERS; THERMAL STRESS;

ABSORPTION CO-EFFICIENT; BUTTERFLY PACKAGES; DAMAGED COMPONENTS; FIBRE-OPTIC CABLES; OPERATIONAL PARAMETERS; OPTICAL FIBER DEVICES; OPTOELECTRONIC COMPONENTS; PROCESS DEVELOPMENT TIME;

SOLDERING;

EID: 84950131676     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012447     Document Type: Conference Paper

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