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Volumn 2002-January, Issue , 2002, Pages 285-291
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Air cooled heat sinks integrated with synthetic jets
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Author keywords
Cogeneration; Electronic packaging thermal management; Electronics cooling; Fans; Heat sinks; Liquid cooling; Microprocessors; Power dissipation; Thermal resistance; Trigeneration
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Indexed keywords
AIR;
AIR EJECTORS;
COOLING;
COOLING SYSTEMS;
EJECTORS (PUMPS);
ELECTRIC LOSSES;
ELECTRONIC COOLING;
ELECTRONICS PACKAGING;
ENERGY DISSIPATION;
FANS;
FINS (HEAT EXCHANGE);
HEAT RESISTANCE;
JETS;
MICROPROCESSOR CHIPS;
THERMOCOUPLES;
COGENERATION;
ELECTRONIC PACKAGING THERMAL MANAGEMENTS;
ELECTRONICS COOLING;
LIQUID COOLING;
TRI-GENERATION;
HEAT SINKS;
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EID: 84950122346
PISSN: 19363958
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ITHERM.2002.1012469 Document Type: Conference Paper |
Times cited : (12)
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References (8)
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