Advanced multi-objective control for epitaxial silicon deposition

ASMC (Advanced Semiconductor Manufacturing Conference) Proceedings

Volumn 2000-January, Issue , 2000, Pages 347-356

  Gower, A ^a   Boning, D ^a   Rosenthal, P ^b   Waldhauer, A ^c  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b On Line Technologies Inc   (United States)

^c APPLIED MATERIALS INC   (United States)

Author keywords

Automatic control; Conductivity; Fabrication; Semiconductor films; Semiconductor process modeling; Sensor phenomena and characterization; Silicon; System testing; Thickness control; Thickness measurement

Indexed keywords

AUTOMATION; CONTROL; DEPOSITION; ELECTRIC CONDUCTIVITY; FABRICATION; MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON; THICKNESS CONTROL; THICKNESS GAGES; THICKNESS MEASUREMENT;

MULTI-OBJECTIVE CONTROL; RESISTIVITY MEASUREMENT; SEMI-CONDUCTOR FABRICATION; SEMICONDUCTOR FILMS; SEMICONDUCTOR PROCESS MODELING; SEMICONDUCTOR PROCESSING; SINGLE INPUT SINGLE OUTPUT; SYSTEM TESTING;

SEMICONDUCTING SILICON;

EID: 84949767310     PISSN: 10788743     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ASMC.2000.902611     Document Type: Conference Paper

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