|
Volumn 2000-January, Issue , 2000, Pages 424-427
|
Formation of robust junction between Cu(InGa)Se2-based absorber and Zn(O,S,OH)x buffer prepared on a 30cm×30cm submodule
|
Author keywords
[No Author keywords available]
|
Indexed keywords
DEPOSITION;
APERTURE AREA;
BASELINE PROCESS;
CONTROL PARAMETERS;
DEPOSITION PROCESS;
ELECTRICAL YIELD;
SUBMODULES;
THICKNESS UNIFORMITY;
ZINC;
|
EID: 84949567364
PISSN: 01608371
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/PVSC.2000.915859 Document Type: Conference Paper |
Times cited : (3)
|
References (7)
|