A comparative study of different plane modelling methodologies for high density electronic packages

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn 2000-January, Issue , 2000, Pages 210-213

  Yeo, Yong Kee ^a   Lee, Shih Yen ^b   Iyer, M K ^a   Leong, Mook Seng ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Circuit simulation; Distributed parameter circuits; Electronics packaging; Frequency; Integrated circuit modeling; Integrated circuit packaging; Power systems; Power transmission lines; Printed circuits; Transmission line matrix methods

Indexed keywords

ELECTRIC POWER TRANSMISSION; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; MATRIX ALGEBRA; PRINTED CIRCUIT BOARDS; PRINTED CIRCUITS; STANDBY POWER SYSTEMS;

DISTRIBUTED PARAMETER CIRCUIT; FREQUENCY; INTEGRATED CIRCUIT MODELING; INTEGRATED CIRCUIT PACKAGING; TRANSMISSION LINE MATRIX METHODS;

CIRCUIT SIMULATION;

EID: 84949549492     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2000.906375     Document Type: Conference Paper

References (5)

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2. P.B. Johns and R.L. Beurle, "Numerical Solution of two dimensional problems using a transmission line matrix", Proc. of IEE, Vol. 118, No. 9, 1971, p.1203.
3. Keunmyung Lee and Alan Barber, "Modeling and Analysis of Multichip Power Supply Planes", IEEE Trans of Comp., Packaging, and Manu. Tech., Part B, Vol.18, No.4, Nov 1995, pp.628-639.
4. th Topical Meeting on Elect. Performance of Electronic Packages, Scottsdale, Arizona, Oct 2000
5. Ansoft High Frequency Structure Simulator User Manual