Electronics design, assembly and reliability for high temperature applications

Proceedings - IEEE International Symposium on Circuits and Systems

Volumn 2015-July, Issue , 2015, Pages 1158-1161

  Riches, S ^a   Johnston, C ^b  

^a GE AVIATION   (United States)

^b UNIVERSITY OF OXFORD   (United Kingdom)

Author keywords

circuit design; high temperature electronics; packaging; reliability

Indexed keywords

AIRCRAFT ENGINES; AUTOMOBILE COOLING SYSTEMS; CHIP SCALE PACKAGES; ELECTRONIC COOLING; FLIGHT CONTROL SYSTEMS; INTEGRATED CIRCUIT MANUFACTURE; PACKAGING; PETROLEUM INDUSTRY; PETROLEUM PROSPECTING; RELIABILITY; SEMICONDUCTOR DEVICES; SILICON CARBIDE; SILICON COMPOUNDS; WIDE BAND GAP SEMICONDUCTORS;

CIRCUIT DESIGNS; EXPLORATION AND PRODUCTIONS; HIGH-TEMPERATURE ELECTRONICS; HIGH-TEMPERATURE ENVIRONMENT; HIGH-TEMPERATURE EXPOSURE; OPERATING TEMPERATURE; PACKAGING TECHNOLOGIES; PERFORMANCE SPECIFICATIONS;

HIGH TEMPERATURE APPLICATIONS;

EID: 84946215185     PISSN: 02714310     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISCAS.2015.7168844     Document Type: Conference Paper

References (5)

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2. Ghandi R et al "Reliability of SiC Digital Telemetry Circuits on AlN Substrates" Proceedings of the HITEN 2013 Conference, Oxford, UK, 8-10 July 2013, pp302-308
3. Lanni L et al "A 4H-SiC Biploar Technology for High TemperatureIntegrated Circuits" Proceedings of the HITEN 2013 Conference, Oxford, UK, 8-10 July 2013, pp282-289.
4. Johnson W R et al "Die Attach for High Temperature Electronics Packaging" Proceedings of the HITEC 2008 Conference, Albuquerque, New Mexico, May 13-15, pp213-219, 2008
5. Shepherd D J et al "The behaviour of Au-Au wire bonds in extreme environments" Proceedings of the HITEC 2010 Conference, Albuquerque, New Mexico, May 11-13, 2010