Micro thermoelectric cooler fabrication: Growth and characterization of patterned Sb2Te3 and Bi2Te3 films

International Conference on Thermoelectrics, ICT, Proceedings

Volumn 2003-January, Issue , 2003, Pages 665-668

  Da Silva, L W ^a   Kaviany, M ^a   DeHennis, A ^a   Dyck, J S ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Bismuth; Chromium; Connectors; Fabrication; Gold; Semiconductor films; Silicon compounds; Substrates; Tellurium; Thermoelectricity

Indexed keywords

BISMUTH; BISMUTH COMPOUNDS; CHROMIUM; CONNECTORS (STRUCTURAL); COOLING SYSTEMS; DEPOSITION; DEPOSITION RATES; FABRICATION; FILMS; GOLD; PHOTORESISTS; SEEBECK COEFFICIENT; SEMICONDUCTING SILICON; SILICON COMPOUNDS; SILICON WAFERS; SUBSTRATES; TELLURIUM; THERMOELECTRIC EQUIPMENT; THERMOELECTRIC REFRIGERATION; THERMOELECTRICITY;

COATED WAFERS; COLUMN HEIGHT; HIGH SUBSTRATE TEMPERATURE; MICRO THERMOELECTRIC COOLERS; P-TYPE; SEMICONDUCTOR FILMS; THERMAL CO-EVAPORATION; THERMOELECTRIC FILM;

SEMICONDUCTING TELLURIUM;

EID: 84946019644     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICT.2003.1287600     Document Type: Conference Paper

References (6)

1. 3(N) Thin Film Thermocouple", Thin Solid Films, 408 (2002), 270-274.
2. Min, G., and Rowe, D.M., "Cooling Performance of Integrated Thermoelectric Microcooler, Solid-State Electronics, Vol. 43 (1999), 923-929.
3. st ICT, 2002, 535-539.
4. da Silva, L.W., and Kaviany, M., "Micro Thermoelectric Cooler: Interfacial Effects on Thermal Electrical Transport", Submitted to IJHMT, 2003. (http://www-personal.engin.umich.edu/~kaviany/researchtopics/lds-ijhmt.pdf)
5. Joint Committee on Powder Diffraction Standards (JCPDS), Powder Diffraction File, Swarthmore, (Pennsylvania, 1983), Cards 8-27 and 15-874.
6. Kim, Y., DiVenere, A., Wong, G.K.L., Ketterson, J.B., Cho, S., and Meyer, J.R., "Structural and Thermoelectric Properties of Sb2Te3 Thin Films Grown by Molecular Beam Epitaxy", J. Appl. Phys., 91, N. 2 (2002), 715-718.