An ultra low power 3D integrated intra-chip silicon electronic-photonic link

Conference on Optical Fiber Communication, Technical Digest Series

Volumn 2015-June, Issue , 2015, Pages

  Timurdogan, Erman ^a   Su, Zhan ^a   Settaluri, Krishna ^b   Lin, Sen ^b   Moazeni, Sajjad ^b   Sun, Chen ^b   Leake, Gerald ^c   Coolbaugh, Douglas D ^c   Moss, Benjamin R ^a   Moresco, Michele ^a   Stojanovic, Vladimir ^b   Watts, Michael R ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

^c STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

OPTICAL FIBERS; SILICON PHOTONICS; SILICON WAFERS;

CHIP ELECTRONICS; LASER ENERGIES; ON CHIPS; PHOTONIC LINKS; RECEIVER SENSITIVITY; SILICON ELECTRONICS; ULTRA LOW POWER;

OPTICAL FIBER COMMUNICATION;

EID: 84945242532     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. A. Joshi, et al., Proceedings of the 2009 3rd ACM/IEEE International Symposium on Networks-on-Chip, 2009.
3. E. Timurdogan, et al., Nat. Comms.. 5, 4008 (2014).
4. C. T. DeRose, et al., Opt. Express, 19, 24897-24904 (2011).
5. F. Y. Liu, et al., IEEE JSSC, 47, 9, 2049-2067.
6. G. Katti, et al., IEEE Electron Device Letters, 31, 6, 549-551 (2010).