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Volumn 1, Issue , 2003, Pages 300-303

A microfluidic system for the measurement of chemical concentration and density

Author keywords

Chemicals; Density measurement; Fluid dynamics; Gravity; Microfluidics; Micromechanical devices; Signal resolution; Temperature control; Temperature sensors; Thermoelectricity

Indexed keywords

ACTUATORS; CHEMICALS; DENSITY MEASUREMENT (SPECIFIC GRAVITY); FLUID DYNAMICS; FLUIDIC DEVICES; GRAVITATION; MICROFLUIDICS; MICROSYSTEMS; SOLID-STATE SENSORS; TEMPERATURE CONTROL; TEMPERATURE SENSORS; THERMOELECTRICITY; TRANSDUCERS;

EID: 84944726633     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1215312     Document Type: Conference Paper
Times cited : (8)

References (6)
  • 1
    • 0142105224 scopus 로고    scopus 로고
    • A micromachined Coriolis-force-based mass flowmeter for direct mass flow and fluid density measurements
    • Y.Zhang, S.Tadigadapa and N.Najafi, "A micromachined Coriolis-force-based mass flowmeter for direct mass flow and fluid density measurements," Transducers'01, 2001, 1460.
    • (2001) Transducers'01 , pp. 1460
    • Zhang, Y.1    Tadigadapa, S.2    Najafi, N.3
  • 3
    • 0033245155 scopus 로고    scopus 로고
    • Chip-scale packaging of a gyroscope using wafer bonding
    • D.Sparks, et al., "Chip-scale packaging of a gyroscope using wafer bonding," Sensors and Materials, Vol. 11, 1999, 197.
    • (1999) Sensors and Materials , vol.11 , pp. 197
    • Sparks, D.1
  • 4
    • 0035506511 scopus 로고    scopus 로고
    • Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder
    • D. Sparks,et al., "Wafer-to-wafer bonding of nonplanarized MEMS surfaces using solder," J. Micromech.&Microengr., Vol.11, No.6, 2001, 630.
    • (2001) J. Micromech.&Microengr. , vol.11 , Issue.6 , pp. 630
    • Sparks, D.1
  • 5
    • 0032136371 scopus 로고    scopus 로고
    • Vacuum-sealed silicon micromachined pressure sensors
    • M.Esashi, et al."Vacuum-sealed silicon micromachined pressure sensors," Proc. IEEE, Vol. 86, No. 8, 1998, 1627.
    • (1998) Proc. IEEE , vol.86 , Issue.8 , pp. 1627
    • Esashi, M.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.