SOI silicon on glass for optical MEMS

TRANSDUCERS 2003 - 12th International Conference on Solid-State Sensors, Actuators and Microsystems, Digest of Technical Papers

Volumn 2, Issue , 2003, Pages 1655-1658

  Larsen, K P ^a   Ravnkilde, J T ^b   Hansen, O ^a  

^a TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^b Dicon A/S   (Denmark)

Author keywords

Etching; Glass; Micromechanical devices; Optical device fabrication; Optical sensors; Packaging; Particle beam optics; Silicon on insulator technology; Wafer bonding; Wafer scale integration

Indexed keywords

ACTUATORS; ELECTRON BEAM LITHOGRAPHY; ELECTRONICS PACKAGING; ETCHING; FABRICATION; GLASS; GLASS BONDING; LITHOGRAPHY; MICROSYSTEMS; MOEMS; OPTICAL SENSORS; PACKAGING; REACTIVE ION ETCHING; SILICON; SILICON WAFERS; SOLID-STATE SENSORS; TRANSDUCERS; WAFER BONDING; WSI CIRCUITS;

CAPACITIVE DEVICES; DEEP REACTIVE ION ETCHING; FABRICATION METHOD; MICROMECHANICAL DEVICE; OPTICAL DEVICE FABRICATION; PARTICLE BEAM OPTICS; SILICON ON INSULATOR WAFERS; SINGLE-CRYSTALLINE;

SILICON ON INSULATOR TECHNOLOGY;

EID: 84944718392     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2003.1217100     Document Type: Conference Paper

References (3)

1. S.Seok, W.Choi and K.Chun, 'A Novel Linearly tuneable MEMS variable capacitor', J. Micromechanics and Microengineering, 12, (2002) 82-86
2. C-H.Kim and Y-K.Kim, 'Micro XY-stage using silicon on a glass substrate', J. Micromechanics and Microengineering, 12, (2002) 103-107
3. Z.Li, Y.Hao, D.Zhang, T.Li and G.Wu, 'An SOI-MEMS technology using substrate layer and bonded glass as wafer-level package', Sensors and Actuators A 96 (2002) 34-42