EM-induced mass transport at the Cu/barrier interface: A new test structure for rapid assessment at user conditions

Proceedings of the IEEE 2003 International Interconnect Technology Conference, IITC 2003

Volumn , Issue , 2003, Pages 21-23

  Bruynseraede, C ^a   Chiaradia, D ^a,b   Wang, H ^a,b   Maex, K ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Bonding; Circuit testing; Electromigration; Electrons; Failure analysis; Finite element methods; Integrated circuit interconnections; Life estimation; Life testing; Silicon carbide

Indexed keywords

BONDING; ELECTRIC NETWORK ANALYSIS; ELECTROMIGRATION; ELECTRONS; FAILURE ANALYSIS; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUIT TESTING; SILICON CARBIDE; SILICON WAFERS;

CIRCUIT TESTING; INTEGRATED CIRCUIT INTERCONNECTIONS; INTERFACE DIFFUSION; LIFE ESTIMATION; LIFE-TESTING; PHYSICAL FAILURE ANALYSIS; SINGLE DAMASCENE; WAFER LEVEL TESTING;

FINITE ELEMENT METHOD;

EID: 84944047198     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2003.1219700     Document Type: Conference Paper

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