Electromigration in sputtered copper interconnection with polyimide as interlevel dielectric or passivation

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 1686-1689

  Chiou, Bi Shiou ^a   Jiang, Jiann Shan ^a   Wang, Hsueh Wen ^a   Hung, Han Yi ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ADHESION; ANNEALING; COPPER; CURING; INTERFACES (MATERIALS); METALLIZING; PASSIVATION; PERMITTIVITY; POLYIMIDES; SECONDARY ION MASS SPECTROMETRY; SURFACE TENSION;

ELECTROMIGRATION DAMAGE; ISOTHERMAL RESISTANCE;

ELECTROMIGRATION;

EID: 0034479505     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)