SCOPUS 정보 검색 플랫폼

Volumn 3, Issue 27, 2015, Pages 7195-7202

Tuning of thermal and dielectric properties for epoxy composites filled with electrospun alumina fibers and graphene nanoplatelets through hybridization

(6) Zha, Jun Wei a,b Zhu, Tian Xing a Wu, Yun Hui a Wang, Si Jiao a Li, Robert K Y b Dang, Zhi Min a

a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING (China)

b CITY UNIVERSITY OF HONG KONG (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; DIELECTRIC PROPERTIES; DIELECTRIC PROPERTIES OF SOLIDS; ELECTRONICS PACKAGING; ELECTROSPINNING; EPOXY RESINS; FILLED POLYMERS; GRAPHENE; HOT PRESSING; SCANNING ELECTRON MICROSCOPY; SOL-GELS;

DECOMPOSITION TEMPERATURE; GRAPHENE NANOPLATELETS; HIGH THERMAL CONDUCTIVITY; HOT-PRESSING PROCESS; INTERFACIAL THERMAL RESISTANCE; LOW THERMAL CONDUCTIVITY; SCANNING ELECTRON MICROSCOPY IMAGE; THERMAL AND DIELECTRIC PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 84936972494 PISSN: 20507534 EISSN: 20507526 Source Type: Journal
DOI: 10.1039/c5tc01552a Document Type: Article

Times cited : (81)

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