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Volumn 18, Issue 2, 2012, Pages 635-641

Diluent filler particle size effect for thermal stability of epoxy type resin

Author keywords

Diluent filler; Epoxy resin; Silica; Thermal conductivity; Thermal stability

Indexed keywords

FILLER PARTICLES; REINFORCEMENT FILLER;

EID: 84862798297     PISSN: 1226086X     EISSN: 22345957     Source Type: Journal    
DOI: 10.1016/j.jiec.2011.11.030     Document Type: Article
Times cited : (24)

References (20)
  • 8
    • 0003551358 scopus 로고
    • American Chemical Society, Washington, DC
    • Bauer R.S. Epoxy Resin Chemistry 1979, American Chemical Society, Washington, DC.
    • (1979) Epoxy Resin Chemistry
    • Bauer, R.S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.