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Volumn 18, Issue 2, 2012, Pages 635-641
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Diluent filler particle size effect for thermal stability of epoxy type resin
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Author keywords
Diluent filler; Epoxy resin; Silica; Thermal conductivity; Thermal stability
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Indexed keywords
FILLER PARTICLES;
REINFORCEMENT FILLER;
EPOXY RESINS;
FILLERS;
METAL MOLDING;
PARTICLE SIZE;
REINFORCEMENT;
RESINS;
SILICA;
SILICON COMPOUNDS;
THERMODYNAMIC STABILITY;
THERMAL CONDUCTIVITY;
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EID: 84862798297
PISSN: 1226086X
EISSN: 22345957
Source Type: Journal
DOI: 10.1016/j.jiec.2011.11.030 Document Type: Article |
Times cited : (24)
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References (20)
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