Investigation of reliability problems in thermal inkjet printhead

IEEE International Reliability Physics Symposium Proceedings

Volumn 2004-January, Issue January, 2004, Pages 251-254

  Lim, Ji Hyuk ^a   Kuk, Keon ^a   Shin, Seung Joo ^a   Baek, Seog Soon ^a   Kim, Young Jae ^a   Shin, Jong Woo ^a   Oh, Yong Soo ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Inkjet; MEMS

Indexed keywords

MEMS; PRINTING MACHINERY; RELIABILITY; RELIABILITY ANALYSIS; THERMAL PRINTING;

DESIGN MODIFICATIONS; FAILURE MECHANISM; INKJET; MEMS PROCESS; MICRO-HEATERS; RELIABILITY ENHANCEMENT; RELIABILITY PROBLEMS; THERMAL INKJET PRINTHEAD;

FAILURE ANALYSIS;

EID: 84932155692     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2004.1315332     Document Type: Conference Paper

References (4)

1. S. S. Baek, H. T. Lim, H. Song, Y. S, Kim, K. D. Bae, C. H, Cho, C. S. Lee, J. W. Shin, K. Kuk, and Y. S. Oh, "T-jet: A novel thermal Inkjet printhead with monolithically fabricated nozzle plate on SOI wafer," Transducers'03, 2003, pp. 472-475.
2. K. Kuk, J. H. Lim, M. S. Kim, M. C. Choi, C. H. Cho, and Y. S. Oh, "Research on micro heater efficiency for thermal inkjet head," IS&T'SNIP 19, 2003, pp. 298-302.
3. D. G. Pierce and P. G. Brusius, "Electromigration: A review," Microelectron. Reliab, 1997, pp. 1053-1072.
4. L. S. Chang and G. Olive, "Factors influencing the lifetime of thermal ink-jet heaters," SID 87 Digest, 1987, pp. 192-195.