Preparation and characterization of thermally-conductive silane-treated silicon nitride filled polybenzoxazine nanocomposites

Materials Letters

Volumn 155, Issue , 2015, Pages 34-37

  Ramdani, Noureddine ^a   Derradji, Mehdi ^a   Feng, Tian Tian ^a   Tong, Zhang ^a   Wang, Jun ^a   Mokhnache, El Oualid ^b   Liu, Wen Bin ^a  

^a HARBIN ENGINEERING UNIVERSITY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Dielectric properties; Nanocomposites; Thermal conductivity; Thermal properties

Indexed keywords

COMPRESSION MOLDING; CONDUCTING POLYMERS; DIELECTRIC PROPERTIES; DIELECTRIC PROPERTIES OF SOLIDS; MICROELECTRONICS; NANOCOMPOSITES; NANOPARTICLES; POLYMER MATRIX COMPOSITES; SILANES; SILICON NITRIDE; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES; THERMODYNAMIC STABILITY;

COMPRESSION-MOLDING TECHNIQUE; CONDUCTIVE POLYMER; FLEXURAL PROPERTIES; MATRIX P; MICROELECTRONIC PACKAGING; POLYBENZOXAZINE; THERMAL AND DIELECTRIC PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 84929087934     PISSN: 0167577X     EISSN: 18734979     Source Type: Journal    
DOI: 10.1016/j.matlet.2015.04.097     Document Type: Article

References (13)

1. J.D. Bolt, D.P. Button, and B.A. Yost Ceramic - fiber - polymer composi or electronic substrates Mater Sci Eng A. 109 1 1989 207 211
2. B. Kiskan, N.N. Ghosh, and Y. Yagci Polybenzoxazine-based composites as high performance materials Polym Int. 60 2011 167 177
3. S. Rimdusit, C. Jubsilp, and S. Tiptipakorn Alloys and Composites of Polybenzoxazines 2013 Springer Singapore
4. N. Ramdani, J. Wang, H. Wang, Feng Tt, M. Derradji, and W.b. Liu Mechanical and thermal properties of silicon nitride reinforced polybenzoxazine nanocomposites Compos Sci Technol 105 2014 73 79
5. S.H. Xie, B.K. Zhu, J.B. Li, X.Z. Wei, and Z.K. Xu Preparation and properties of polyimide/aluminum nitride composites Polym Test. 23 2004 797 801
6. 4 particle filled epoxy composites with a novel structure J Electron Packag 129 4 2007 469
7. 3/poly(ether ether ketone) nanocomposites for electronics applications Compos Sci Technol 67 9 2007 1802 1812
8. F.Y. Yuan, H.B. Zhang, X. Li, X.Z. Li, and Z.Z. Yu Synergistic effect of boron nitride flakes and tetrapod-shaped ZnO whiskers on the thermal conductivity of electrically insulating phenol formaldehyde composites Compos Part A Appl Sci Manuf 53 2013 137 144
9. H. Ishida, and S. Rimdusit Very high thermal conductivity obtained by boron nitride-flled polybenzoxazine Thermochim Acta. 320 1998 177 186
10. X. Ning, and H. Ishida Phenolic materials via ring-opening polymerization: synthesis and characterization of bisphenol-A based benzoxazines and their polymers J Polym Sci Part A: Polym Chem 32 1994 1121 1129
11. W. Zhou, C. Wang, T. Ai, K. Wu, F. Zhao, and H. Gu A novel fiber-reinforced polyethylene composite with added silicon nitride particles for enhanced thermal conductivity Compos A: Appl Sci Manuf 40 6-7 2009 830 836
12. H. He, R. Fu, Y. Shen, Y. Han, and X. Song Preparation and properties of Si3N4/PS composites used for electronic packaging Compos Sci Technol 67 2007 2493 2499
13. T. Tanaka, M. Kuzako, and K. Okamoto Toward high thermal conductivity nano micro epoxy composites with sufficient endurance voltage J Int Counc Electr Eng 2 2012 90 98