The evolution of microstructure due to heat treatment on highly porous copper/silver systems

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 8, Issue , 2007, Pages 971-977

  Murtha, Brian A ^a,b   Kulkarni, Anil K ^a   Singh, Jogender ^a  

^a The Pennsylvania State University   (United States)

^b Voith Paper GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER POWDER; FLOW OF FLUIDS; HEAT TRANSFER; HEAT TREATMENT; MICROSTRUCTURAL EVOLUTION; MICROSTRUCTURE; POROUS MATERIALS; SINTERING;

AFTER-HEAT TREATMENT; FURNACE TEMPERATURES; HIGHLY POROUS MATERIALS; INITIAL MICROSTRUCTURES; MATERIAL COMPOSITIONS; PARTICLE GEOMETRIES; PARTICLE SURFACE AREA; SINTERING PHENOMENON;

HEAT TREATING FURNACES;

EID: 84928602802     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2007-43810     Document Type: Conference Paper

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