Effects of heat treatment on thermal conductivity of highly porous copper/silver systems

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

Volumn 8, Issue , 2007, Pages 979-987

  Murtha, Brian A ^a,b   Kulkarni, Anil K ^a   Singh, Jogender ^a  

^a The Pennsylvania State University   (United States)

^b Voith Paper GmbH and Co KG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION IN SOLIDS; FLOW OF FLUIDS; GRAIN BOUNDARIES; HEAT TRANSFER; HEAT TREATMENT; MICROSTRUCTURE; POROUS MATERIALS; SINTERING;

CONDUCTIVE HEAT TRANSFER; EFFECTS OF HEAT TREATMENT; HIGHLY POROUS MATERIALS; INDIVIDUAL PARTICLES; MATERIAL CHANGE; PARTICLE DIFFUSION; POROUS COPPERS; WEIGHTING FUNCTIONS;

THERMAL CONDUCTIVITY;

EID: 84928594625     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/IMECE2007-43817     Document Type: Conference Paper

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