Hybrids of silver nanowires and silica nanoparticles as morphology controlled conductive filler applied in flexible conductive nanocomposites

Composites Part A: Applied Science and Manufacturing

Volumn 73, Issue , 2015, Pages 195-203

  Wei, Yong ^a   Chen, Shilong ^a   Li, Fucheng ^a   Liu, Konghua ^a   Liu, Lan ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

A. Hybrid; A. Nano structures; A. Polymer matrix composites (PMCs); B. Electrical properties

Indexed keywords

ELECTRIC RESISTANCE MEASUREMENT; FLEXIBLE ELECTRONICS; HYDROGEN BONDS; NANOCOMPOSITES; NANOPARTICLES; NANOSTRUCTURES; NANOWIRES; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); POLYPROPYLENES; SILICA; SILVER; SOLVENTS; VAN DER WAALS FORCES;

A. HYBRID; CONDUCTIVE FILLERS; CONDUCTIVE POLYMER; MORPHOLOGY-CONTROLLED; PERCOLATION THRESHOLDS; POLYMER MATRIX COMPOSITES (PMCS); SILICA NANOPARTICLES; WATERBORNE POLYURETHANES;

POLYMER MATRIX COMPOSITES;

EID: 84925674878     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2015.03.003     Document Type: Article

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