SCOPUS 정보 검색 플랫폼

Volumn 6, Issue 9, 2014, Pages 4812-4818

Annealing-free and strongly adhesive silver nanowire networks with long-term reliability by introduction of a nonconductive and biocompatible polymer binder

(5) Jin, Yunxia a Deng, Dunying a Cheng, Yuanrong a Kong, Lingqiang a Xiao, Fei a

a FUDAN UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; BINDERS; CONDUCTIVE FILMS; ELECTRIC RESISTANCE MEASUREMENT; FUNCTIONAL GROUPS; INDUSTRIAL APPLICATIONS; MECHANICAL PROPERTIES; NANOWIRES; SILVER; SUBSTRATES; TIN;

BIOCOMPATIBLE POLYMER; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL PERFORMANCE; FLEXIBLE ELECTRONIC DEVICES; HIGH-TEMPERATURE ANNEALING; INDIUM TIN OXIDE FILMS; TRANSPARENT CONDUCTIVE FILMS; TRANSPARENT ELECTRODE;

FILM PREPARATION;

EID: 84898661219 PISSN: 20403364 EISSN: 20403372 Source Type: Journal
DOI: 10.1039/c3nr05820d Document Type: Article

Times cited : (119)

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