Application of graphene as filler to improve thermal transport property of epoxy resin for thermal interface materials

International Journal of Heat and Mass Transfer

Volumn 85, Issue , 2015, Pages 420-429

  Tang, Bo ^a,b   Hu, Guoxin ^a   Gao, Hanyang ^a   Hai, Liuyu ^c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b CHANGZHOU UNIVERSITY   (China)

^c Beijing Fangda Research Institute   (China)

Author keywords

Graphene; Kapitza resistance; Thermal conductivity; Thermal interface materials

Indexed keywords

ELECTRONIC EQUIPMENT; EPOXY RESINS; FILLERS; FUNCTIONAL GROUPS; GRAPHENE; INTERFACES (MATERIALS); MECHANICAL PROPERTIES; THERMAL INSULATING MATERIALS;

ELECTRONIC COMPONENT; KAPITZA RESISTANCE; MECHANICAL PERFORMANCE; SURFACE FUNCTIONAL GROUPS; THERMAL CONDUCTIVITY ENHANCEMENT; THERMAL INTERFACE MATERIALS; THERMAL PERFORMANCE; THERMAL TRANSPORT PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 84923274817     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2015.01.141     Document Type: Article

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