Solvent-free fabrication of thermally conductive insulating epoxy composites with boron nitride nanoplatelets as fillers

Nanoscale Research Letters

Volumn 9, Issue 1, 2014, Pages

  Wang, Zifeng ^a   Fu, Yuqiao ^a   Meng, Wenjun ^a   Zhi, Chunyi ^a  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Boron nitride nanoplatelets; Epoxy composites; Solvent free fabrication; Thermal conductivity

Indexed keywords

BORON NITRIDE; FILLED POLYMERS; FILLERS; III-V SEMICONDUCTORS; NITRIDES; SOLVENTS; THERMAL CONDUCTIVITY;

CONDUCTIVE EPOXY; EPOXY COMPOSITE; FILLER FRACTION; NANO-PLATELETS; POLYMER COMPOSITE; PRISTINE EPOXY; SOLVENT-FREE FABRICATION; SOLVENT-FREE METHOD;

FABRICATION;

EID: 84916613093     PISSN: 19317573     EISSN: 1556276X     Source Type: Journal    
DOI: 10.1186/1556-276X-9-643     Document Type: Article

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