A 0.2nJ/pixel 4K 60fps Main-10 HEVC decoder with multi-format capabilities for UHD-TV applications

European Solid-State Circuits Conference

Volumn , Issue , 2014, Pages 195-198

  Ju, Chi Cheng ^a   Liu, Tsu Ming ^a   Chang, Yung Chang ^a   Wang, Chih Ming ^a   Lin, Hue Min ^a   Cheng, Chia Yun ^a   Chen, Chun Chia ^a   Chiu, Min Hao ^a   Wang, Sheng Jen ^a   Chao, Ping ^a   Hu, Meng Jye ^a   Yeh, Fu Chun ^a   Chuang, Shun Hsiang ^a   Lin, Hsiu Yi ^a   Wu, Ming Long ^a   Chen, Che Hong ^a   Tsai, Chung Hung ^a  

^a MEDIATEK INC   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BUFFER STORAGE; DATA SHARING; DECODING; DYNAMIC RANDOM ACCESS STORAGE; ENERGY EFFICIENCY; PHYSICAL ADDRESSES; WAVEFRONTS;

ADAPTIVE CODING; FRAME BUFFER; MULTI STANDARD; STATE OF THE ART; VIDEO DECODER CHIPS; VIDEO DECODERS; VIDEO PLAYBACK; WORKING FREQUENCY;

MEMORY MANAGEMENT UNITS;

EID: 84909978128     PISSN: 19308833     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSCIRC.2014.6942055     Document Type: Conference Paper

References (6)

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2. B. Bross,W. J. Han, J. R. Ohm, G. J. Sullivan, and T.Wiegand, "High Efficiency Video Coding (HEVC) text specification draft 10 (for FDIS & Consent)," Joint Collaborative Team on Video Coding (JCT-VC) of ITU-T SG16 WP3 and ISO/IEC JTC1/SC29/WG11, Jan. 2013.
3. Ke Xu, Chiu-Sing Choy, Cheong-Fat Chan, Kong-Pong Pun, "A Lowpower BitStream Controller for H.264/AVC Baseline Decoding," IEEE Symposium on VLSI Circuits, pp. 162-165, June 2006.
4. Tsu-Ming Liu, et al., "A 125μW, Fully Scalable MPEG-2 and H.264/AVC Video Decoder for Mobile Applications," IEEE Journal of Solid-State Circuits, pp. 160-169, Jan. 2007.
5. K. Nitta, et al., "An H.264/AVC High422 profile and MPEG-2 422 profile encoder LSI for HDTV broadcasting infrastructures," IEEE Symposium on VLSI Circuits, pp. 106-107, June 2008.
6. Chao-Tsung Huang, Mehul Tikekar, Chiraag Juvekar, Vivienne Sze, Anantha Chandrakasan, "A 249Mpixel/s HEVC Video-Decoder Chip for Quad Full HD Applications," ISSCC Dig. Tech. Papers, pp. 162-163, Feb. 2013.