Scratching and brittle fracture of semiconductor in-situ scanning electron microscope

Fracture of Nano and Engineering Materials and Structures - Proceedings of the 16th European Conference of Fracture

Volumn , Issue , 2006, Pages 117-118

  Wasmer, K ^a   Pouvreau, C ^b   Giovanola, J ^b   Michler, J ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EPFL   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84908275051     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1007/1-4020-4972-2_56     Document Type: Conference Paper

References (7)

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3. Ballif, C., Wasmer, K., Gassilloud, R., Pouvreau, C., Rabe, R., Michler, J., Breguet, J.-M., Solletti, J.-M., Karimi, A. and Schulz, D. Advanced Engineering Materials, June 2005.
4. Gassilloud, R., Ballif, C., Michler, J. and Schmuki, P., Submitted at Journal of Material Research.
5. Rabe, R., Breguet, J.-M., Schwaller, P., Stauss, S., Patscheider J. and J. Michler, Thin Solid Films, Vol. 469-470, pp: 206-213, 2004.
6. Lawn, B., "Fracture of Brittle Solids", 2nd Ed., Cambridge University Press, 1997.
7. Sauthoff, K., Wenderoth, M., Heinrich, A. J., Engel, K. J., Reusch, T. C. G. and Ulbrich, R. G., Phys. Rev. B, Vol. 60, pp: 4789-95, 1999.