Polymer optical interconnect technologies for polylithic gigascale integration

European Solid-State Device Research Conference

Volumn , Issue , 2003, Pages 119-122

  Mule, A V ^a   Joseph, P J ^a   Allen, S A B ^a   Kohl, P A ^a   Gaylord, T K ^a   Meindl, J D ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

GIGASCALE INTEGRATION; POLYMER OPTICAL INTERCONNECT;

EID: 84907707116     PISSN: 19308876     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESSDERC.2003.1256825     Document Type: Conference Paper

References (4)

1. M. Bakir, H. A. Reed, P. A. Kohl, K. P. Martin, and J. D. Meindl, "Sea of Leads ultra-high density compliant wafer level packaging technology," IEEE Electronic Components and Technology Conference. San Diego, Ca: pp. 1087-1094, May 2002.
2. H. A. Reed, M. S. Bakir, C. S. Patel, K. P. Martin, J. D. Meindl, and P. A. Kohl, "Compliant wafer-level package (CWLP) with embedded air-gaps for Sea-of-Leads (SoL) interconnections," Proc. IEEE International Interconnect Technology Conference. San Francisco, CA: pp. 151-153, June 2001.
3. A. V. Mule', M. Bakir, J. Jayachandran, R. Villalaz, H. Reed, K.. Martin, P. Kohl, E. Glytsis, T. Gaylord, J. Meindl, N. Agrawal, S. Ponoth, J. Plawsky, and P. Persans, "Optical waveguides embedded within a sea-of-leads (SoL) wafer-level package," Proc. IEEE International Interconnect Technology Conference. San Francisco, CA: pp. 122-124, June 2002.
4. M. A. Fardad and M. Fatlahi, "Sol-Gel Multimode Interference Power Splitters." IEEE Photon. Tecknol Lett., vol. 11, pp. 697-699, June 1999.