Sub-10-nm-wide intercalated multi-layer graphene interconnects with low resistivity

2014 IEEE International Interconnect Technology Conference / Advanced Metallization Conference, IITC/AMC 2014

Volumn , Issue , 2014, Pages 189-192

  Kondo, Daiyu ^a   Nakano, Haruhisa ^a   Zhou, Bo ^a   Akiko, I ^a   Hayashi, Kenjiro ^a   Takahashi, Makoto ^a   Sato, Shintaro ^a   Yokoyama, Naoki ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRON BEAM LITHOGRAPHY; GRAPHENE; METALLIZING;

COBALT FILM; CU-INTERCONNECTS; HIGH QUALITY; LOW RESISTIVITY; LSI INTERCONNECTS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84903711594     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2014.6831867     Document Type: Conference Paper

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