An integrated crack-opening method for determining the work of fracture of bonded polymer interfaces

12th International Conference on Miniaturized Systems for Chemistry and Life Sciences - The Proceedings of MicroTAS 2008 Conference

Volumn , Issue , 2008, Pages 1555-1557

  Taylor, Hayden ^a   Boning, Duane ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Bonding; Interface toughness; Polymers; Polymethylmethacrylate

Indexed keywords

BONDING; CHEMICAL BONDS; CRACKS; FRACTURE; POLYMERS; POLYMETHYL METHACRYLATES;

BOND TOUGHNESS; INTERFACE TOUGHNESS; MICROFABRICATED DEVICES; NON DESTRUCTIVE; POLYMER INTERFACES; POLYMERIC LAYERS; SPATIAL UNIFORMITY; WORK OF FRACTURE;

INTERFACES (MATERIALS);

EID: 84902460904     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. A. Bhattacharyya and C.M. Klapperich, Lab on a Chip, 7, 876-882 (2007).
2. C.W. Tsao, L. Hromada, J. Liu, P. Kumar and D.L. DeVoe, Lab on a Chip, 7, 499-505 (2007).
3. Ö. Vallin, K. Jonsson and U. Lindberg, Materials Science and Engineering, 50, 109-165 (2005).
4. Q.-Y. Tong and U. Gösele, Semiconductor Wafer Bonding: Science and Technology, Wiley (1999).