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Volumn 34, Issue 7, 2014, Pages 1264-1273

Evaluation of a recycling process for printed circuit board by physical separation and heat treatment

Author keywords

Evaluation; Heat treatment; Physical separation; Printed circuit board; Recycling

Indexed keywords

CARBONIZATION; CERAMIC CAPACITORS; COPPER; COSTS; DOMESTIC APPLIANCES; ENERGY UTILIZATION; EPOXY RESINS; GLASS FIBERS; GRINDING (COMMINUTION); HEAT TREATMENT; HEATING; MAGNETIC SEPARATION; NICKEL; ORGANIC POLLUTANTS; PERSONAL COMPUTERS; POLYCHLORINATED BIPHENYLS; PRINTED CIRCUIT BOARDS; RECOVERY; RECYCLING; SEPARATION; SINTERING;

EID: 84901984843     PISSN: 0956053X     EISSN: 18792456     Source Type: Journal    
DOI: 10.1016/j.wasman.2014.03.002     Document Type: Article
Times cited : (77)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.