Cementation-induced recovery of self-assembled ultrafine copper powders from spent etching solutions of printed circuit boards

Powder Technology

Volumn 159, Issue 3, 2005, Pages 127-134

  Fouad, O A ^a   Abdel Basir, S M ^a  

^a CENTRAL METALLURGICAL RESEARCH AND DEVELOPMENT INSTITUTE CMRDI   (Egypt)

Author keywords

Cementation; Printed circuit boards; Scrap iron chips; Spent etching solutions; Ultrafine copper powders

Indexed keywords

CEMENTS; COPPER; ETCHING; IMPURITIES; IRON; PRINTED CIRCUIT BOARDS; SELF ASSEMBLY; SOLUTIONS;

CEMENTATION; SCRAP IRON CHIPS; SPENT ETCHING SOLUTIONS; ULTRAFINE COPPER POWDERS;

POWDER METALS;

AMMONIA; COPPER; NANOPARTICLE;

POWDER;

ACID PRECIPITATION; ADSORPTION; ARTICLE; CEMENTATION; CHEMICAL REACTION; CONTACT ANGLE; DRY POWDER; ION EXCHANGE; METALLURGY; PARTICLE SIZE; PH MEASUREMENT; STOICHIOMETRY; TEMPERATURE DEPENDENCE;

EID: 26844579327     PISSN: 00325910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.powtec.2005.08.001     Document Type: Article

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