A study of the dependence of electrohydrodynamic jetting on the process parameters and liquid physical properties

Chinese Journal of Physics

Volumn 52, Issue 2, 2014, Pages 799-815

  Choi, Kyung Hyun ^a   Ali, Kamran ^a   Rahman, Khalid ^b  

^a Jeju National University   (South Korea)

^b GIK INSTITUTE OF ENGINEERING SCIENCES AND TECHNOLOGY   (Pakistan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84901910546     PISSN: 05779073     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (29)

1. T. R. Hebner, C. C. Wu, D. Marcy, M. H. Lu, and J. C. Sturm, Appl. Phys. Lett. 72, 519 (1998). doi: 10.1063/1.120807
2. T. Goldmann and J. S. Gonzalez, J. Biochem. Biophys. Methods 42, 105 (2000). doi: 10.1016/S0165-022X(99)00049-4
3. D. B. Chrisey, Science 289, 879 (2000). doi: 10.1126/science.289.5481.879
4. J. U Park et al., Nat. Mater. 6, 782 (2007). doi: 10.1126/science.289.5481.879
5. S. N. Jayasinghe and M. J. Edirisinghe, J. Aerosol. Sci. 33, 1379 (2002). doi: 10.1016/S0021-8502(02)00088-5
6. D. A. Saville, Phys. Fluids 14, 1095 (1971). doi: 10.1063/1.1693569
7. K. H. Choi, K. Rahman, A. Khan, and D. S. Kim, J. Mech. Sci. Technol. 25, 1 (2011). doi:10.1007/s12206-011-0333-z
8. D. S. Kim, K. Rahman, A. Khan, and K. H. Choi, to appear in Mater. Manuf. Process. doi:10.1080/10426914.2012.663121
9. K. H. Choi et al., Recent Advances in Nanofabrication Techniques and Applications, ed. B. Cui (InTech. Rijeka, Croatia, 2011) Chap. 27.
10. K. Rahman, J. B. Ko, S. Khan, D. S. Kim, and K. H. Choi, J. Mech. Sci. Technol. 24, 307 (2010). doi: 10.1007/s12206-009-1149-y
11. K. Rahman, A. Khan, N. M. Nam, K. H. Choi, and D. S. Kim, Int. J. Precis. Eng. Manuf. 12, 663 (2011). doi: 10.1007/s12541-011-0086-8
12. N. M. Muhammad et al., Curr. Appl. Phys. 11, S68 (2011).
13. N. M. Muhammad, N. Duraisamy, D. S. Kim, and K. H. Choi, Thin Solid Films 520, 1751 (2012). doi: 10.1016/j.tsf.2011.08.065
14. K. H. Choi, M. Mustafa, K. Rahman, J. B. Ko, and Y. H. Doh, Appl. Phys. A-Mater. Sci. Process. 106, 165 (2012).
15. A. Khan, K. Rahman, D. S. Kim, and K. H. Choi, J. Mater. Process. Technol. 212, 700 (2012). doi: 10.1016/j.jmatprotec.2011.10.024
16. D. S. Kim et al., Mater. Manuf. Process. 26, 1196 (2011). doi: 10.1080/10426914.2011.551956
17. A. Khan, K. Rahman, M. T. Hyun, D. S. Kim, and K. H. Choi, Appl. Phys. A-Mater. Sci. Process. 104, 1113 (2011).
18. K. H. Choi et al., J. Micromech. Microeng. 20, 075033 (2010). doi: 10.1088/0960-1317/20/7/075033
19. S. Khan et al., Curr. Appl. Phys. 11, S271 (2011). doi: 10.1016/j.cap.2010.11.044
20. J. Choi et al., Appl. Phys. Lett. 93, 193508 (2008). doi: 10.1063/1.3020719
21. H. F. Poon, PhD. Thesis, (Princeton University, Princeton, 2002).
22. M. M. Hohman, M. Shin, G. Rutledge, and M. Brennera, Phys. Fluids 13, 2201 (2001).
23. M. W. Lee et al., J. Aerosol. Sci. 46, 1 (2012).
24. J. Kim, H. Oh, and S. S. Kim, J. Aerosol. Sci. 39, 819 (2008). doi: 10.1016/j.jaerosci.2008.05.001
25. A. Barrero, A. M. Gañán-Calvo, J. Dávila, A. Palacios, and E. Gómez-González, J. Electrost. 47, 13 (1999). doi: 10.1016/S0304-3886(99)00021-2
26. M. Cloupeau and B. Prunet-foch, J. Aerosol. Sci. 25, 1021 (1994). doi: 10.1016/0021-8502(94)90199-6
27. I. Hayati, A. I. Bailey, and T. F. Tadros, J. Colloid Interface Sci. 117, 205 (1987). doi: 10.1016/0021-9797(87)90185-8
28. J. M. Kay and R. M. Nedderman, Fluid Mechanics and Transfer Processes (Cambridge University Press, 1990). 384-386.
29. A. M. Gañán-Calvo, J. Dávila, and A. Barrero, J. Aerosol. Sci. 28, 249 (1997). doi: 10.1016/S0021-8502(96)00433-8