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Volumn 37, Issue 1, 2014, Pages 71-76

Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film

Author keywords

Electroless copper plating; Heterocyclic organosilane; Orthogonal; Self assembled film

Indexed keywords

ADHESION; COPPER; COPPER PLATING; ELECTRIC CORONA; METALLIC FILMS; ORGANIC COMPOUNDS; PLATING; RESINS; SELF ASSEMBLY; STYRENE; SURFACE ROUGHNESS;

EID: 84899944053     PISSN: 02504707     EISSN: None     Source Type: Journal    
DOI: 10.1007/s12034-014-0615-z     Document Type: Article
Times cited : (12)

References (16)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.