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Volumn 37, Issue 1, 2014, Pages 71-76
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Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film
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Author keywords
Electroless copper plating; Heterocyclic organosilane; Orthogonal; Self assembled film
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Indexed keywords
ADHESION;
COPPER;
COPPER PLATING;
ELECTRIC CORONA;
METALLIC FILMS;
ORGANIC COMPOUNDS;
PLATING;
RESINS;
SELF ASSEMBLY;
STYRENE;
SURFACE ROUGHNESS;
ACRYLONITRILE BUTADIENE STYRENE;
ADHESION PROPERTIES;
ELECTROLESS COPPER;
ELECTROLESS COPPER PLATING;
ORGANOSILANES;
ORTHOGONAL;
SELF ASSEMBLED FILMS;
SURFACE APPEARANCE;
ABS RESINS;
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EID: 84899944053
PISSN: 02504707
EISSN: None
Source Type: Journal
DOI: 10.1007/s12034-014-0615-z Document Type: Article |
Times cited : (12)
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References (16)
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