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Volumn , Issue , 2014, Pages 532-535
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Printing and encapsulation of electrical conductors on polylactic acid (PLA) for sensing applications
a
EPFL
(Switzerland)
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Author keywords
[No Author keywords available]
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Indexed keywords
INK;
INTEGRODIFFERENTIAL EQUATIONS;
MEMS;
POLYESTERS;
SILVER;
SINTERING;
ELECTRICAL CONDUCTORS;
LOW GLASS TRANSITION TEMPERATURES;
MECHANICAL FLEXIBILITY;
MECHANICAL INTEGRITY;
PRINTED STRUCTURES;
PRINTING TECHNIQUES;
SENSING APPLICATIONS;
TEMPERATURE AND HUMIDITIES;
PRINTING;
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EID: 84898955563
PISSN: 10846999
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/MEMSYS.2014.6765695 Document Type: Conference Paper |
Times cited : (28)
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References (5)
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