Conductive layer deposition and peel tests on biodegradable printed circuit boards

2012 IEEE 18th International Symposium for Design and Technology of Electronics Packages, SIITME 2012 - Conference Proceedings

Volumn , Issue , 2012, Pages 139-142

  Geczy, Attila ^a   Kovacs, Mark ^a   Hajdu, Istvan ^a  

^a BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Biodegradable materials; biopolymers; circuit boards; eco friendly; environmentally friendly

Indexed keywords

BIODEGRADABLE MATERIAL; BIODEGRADABLE PLASTICS; BONDING STRENGTH; CIRCUIT BOARDS; COATING PROCESS; CONDUCTIVE LAYER; COPPER ELECTROPLATING; COPPER FOILS; COPPER LAYER; ECO-FRIENDLY; ENVIRONMENTALLY-FRIENDLY; NOVEL MATERIALS; PEEL TESTS; POLY LACTIDE;

BIODEGRADABLE POLYMERS; BIOPOLYMERS; COPPER; LAMINATING; OPTICAL MICROSCOPY; PEELING; THICK FILMS;

PRINTED CIRCUIT BOARDS;

EID: 84872381678     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SIITME.2012.6384363     Document Type: Conference Paper

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