A simple way to prepare large-scale copper nanoparticles for conductive ink in printed electronics

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Volumn , Issue , 2013, Pages 317-320

  Zhang, Yu ^a   Zhu, Pengli ^a   Sun, Rong ^a   Wong, Chingping ^b  

^a SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY   (China)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Conductive ink; Copper nanoparticles; Patterns; PCB

Indexed keywords

ELECTRONICS PACKAGING; POLYCHLORINATED BIPHENYLS;

CONDUCTIVE INK; CONDUCTIVE PATTERNS; COPPER NANOPARTICLES; FLEXIBLE SUBSTRATE; INERT ATMOSPHERES; PATTERNS; PRINTED ELECTRONICS; SILK-SCREEN PRINTING;

METAL NANOPARTICLES;

EID: 84898037757     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2013.6756479     Document Type: Conference Paper

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