Graphene based heat spreader for high power chip cooling using flip-chip technology

Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013

Volumn , Issue , 2013, Pages 347-352

  Huang, Shirong ^a   Zhang, Yong ^a,c   Sun, Shuangxi ^c   Fan, Xiaogang ^a   Wang, Ling ^a   Fu, Yifeng ^b   Zhang, Yan ^a   Liu, Johan ^a,c  

^a SHANGHAI UNIVERSITY   (China)

^b SHT SMART HIGH TECH AB   (Sweden)

^c CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING PERFORMANCE; FLIP CHIP TECHNOLOGIES; HIGH POWER CHIPS; SYNTHESIS PARAMETERS; THERMAL CHEMICAL VAPOR DEPOSITION; THERMAL TESTING; TRANSFER PROCESS; UNIFORM TEMPERATURE;

CHEMICAL VAPOR DEPOSITION; COOLING; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; HEAT FLUX; HEATING EQUIPMENT; MONOLAYERS; PLATINUM; SERPENTINE; TECHNOLOGY;

GRAPHENE;

EID: 84897786019     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2013.6745740     Document Type: Conference Paper

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