Graphene heat spreader for thermal management of hot spots

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 2075-2078

  Gao, Zhaoli ^a,b   Zhang, Yong ^a,c   Fu, Yifeng ^d   Yuen, Matthew ^b   Liu, Johan ^a,c  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

^c SHANGHAI UNIVERSITY   (China)

^d SHT SMART HIGH TECH AB   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS COMPATIBLE; ELECTRONIC PACKAGING; HEAT SPREADERS; HOT SPOT; THERMAL CHEMICAL VAPOR DEPOSITION; THERMAL EVALUATIONS; THERMAL PERFORMANCE;

CHEMICAL VAPOR DEPOSITION; ELECTRONICS PACKAGING; HEAT FLUX; HEATING EQUIPMENT; PLATINUM;

GRAPHENE;

EID: 84883333185     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575865     Document Type: Conference Paper

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