MCM-D technology for realisation of low cost system-on-package concept at 60-80GHz

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2002-January, Issue , 2002, Pages 55-58

  Grzyb, Janusz ^a   Ruiz, Ivan ^a   Klemm, Maciej ^b   Troster G ^a  

^a ETH ZURICH   (Switzerland)

^b GDANSK UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNA ARRAYS; ANTENNAS; BANDPASS FILTERS; CHIP SCALE PACKAGES; COSTS; DIRECTIONAL COUPLERS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATION; MICROSTRIP ANTENNAS; SLOT ANTENNAS; SYSTEM-ON-PACKAGE; VOLTAGE DIVIDERS;

BRANCH LINE COUPLERS; COMPENSATING TECHNIQUES; DISTRIBUTED PASSIVES; INTEGRATED CAPACITORS; LOW COST INTEGRATION; MICROSTRIP CONFIGURATION; MICROSTRIP PATCH ARRAYS; MILLIMETRE WAVE APPLICATIONS;

PACKAGING;

EID: 33746923898     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2002.1057882     Document Type: Conference Paper

References (9)

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