-
1
-
-
0033890396
-
Bayesian surrogates for integrating numerical, analytical, and experimental data: Application to inverse heat transfer in wearable computers
-
DOI 10.1109/6144.833038
-
N. Leoni, and C.H. Amon Bayesian surrogates for integrating numerical, analytical, and experimental data: application to inverse heat transfer in wearable computers IEEE Trans. Compon. Packag. Technol. 23 2000 23 32 (Pubitemid 30593779)
-
(2000)
IEEE Transactions on Components and Packaging Technologies
, vol.23
, Issue.1
, pp. 23-32
-
-
Leoni, N.1
Amon, C.H.2
-
2
-
-
0032164537
-
Avionics Passive Cooling with Microencapsulated Phase Change Materials
-
A.J. Fossett, M.T. Maguire, A.A. Kudirka, F.E. Mills, and D. Brown Avionics passive cooling with microencapsulated phase change materials ASME J. Electron. Packag. 120 1998 238 242 (Pubitemid 128444951)
-
(1998)
Journal of Electronic Packaging, Transactions of the ASME
, vol.120
, Issue.3
, pp. 238-242
-
-
Fossett, A.J.1
Maguire, M.T.2
Kudirka, A.A.3
Mills, F.E.4
Brown, D.A.5
-
3
-
-
0032047946
-
Thermal management of an avionics module using solid-liquid phase-change materials
-
D. Pal, and Y.K. Joshi Thermal management of an avionics module using solid-liquid phase-change materials AIAA J. Thermophys. Heat Transfer 12 1998 256 262 (Pubitemid 128655269)
-
(1998)
Journal of Thermophysics and Heat Transfer
, vol.12
, Issue.2
, pp. 256-262
-
-
Pal, D.1
Joshi, Y.K.2
-
4
-
-
71849083002
-
Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks
-
S.C. Fok, W. Shen, and F.L. Tan Cooling of portable hand-held electronic devices using phase change materials in finned heat sinks Int. J. Therm. Sci. 49 2010 109 117
-
(2010)
Int. J. Therm. Sci.
, vol.49
, pp. 109-117
-
-
Fok, S.C.1
Shen, W.2
Tan, F.L.3
-
5
-
-
34447501562
-
Application of phase change materials in thermal management of electronics
-
DOI 10.1016/j.applthermaleng.2006.12.013, PII S1359431107000063
-
R. Kandasamy, X.Q. Wang, and A.S. Mujumdar Application of phase change materials in thermal management of electronics Appl. Therm. Eng. 27 2007 2822 2832 (Pubitemid 47296383)
-
(2007)
Applied Thermal Engineering
, vol.27
, Issue.17-18
, pp. 2822-2832
-
-
Kandasamy, R.1
Wang, X.-Q.2
Mujumdar, A.S.3
-
6
-
-
78149413789
-
Thermal conductivity enhancement of phase change materials for thermal energy storage: A review
-
L. Fan, and J.M. Khodadadi Thermal conductivity enhancement of phase change materials for thermal energy storage: a review Renewable Sustainable Energy Rev. 15 2011 24 46
-
(2011)
Renewable Sustainable Energy Rev.
, vol.15
, pp. 24-46
-
-
Fan, L.1
Khodadadi, J.M.2
-
7
-
-
0013180684
-
Transient Thermal Management of a Handset Using Phase Change Material (PCM)
-
DOI 10.1115/1.1523061
-
M. Hodes, R. Weinstein, S.J. Pence, J.M. Piccini, L. Manzione, and C. Chen Transient thermal management of a handset using phase change material (PCM) ASME J. Electron. Packag. 124 2002 419 426 (Pubitemid 135703595)
-
(2002)
Journal of Electronic Packaging, Transactions of the ASME
, vol.124
, Issue.4
, pp. 419-426
-
-
Hodes, M.1
Weinstein, R.D.2
Pence, S.J.3
Piccini, J.M.4
Manzione, L.5
Chen, C.6
-
8
-
-
79959343143
-
A direct comparison of three different material enhancement methods on the transient thermal response of paraffin phase change material exposed to high heat fluxes
-
K. Chintakrinda, R.D. Weinstein, and A.S. Fleischer A direct comparison of three different material enhancement methods on the transient thermal response of paraffin phase change material exposed to high heat fluxes Int. J. Therm. Sci. 50 2011 1639 1647
-
(2011)
Int. J. Therm. Sci.
, vol.50
, pp. 1639-1647
-
-
Chintakrinda, K.1
Weinstein, R.D.2
Fleischer, A.S.3
-
9
-
-
59349120477
-
Investigation of planted pin fins for heat transfer enhancement in plate fin heat sink
-
Y. Yang, and H. Peng Investigation of planted pin fins for heat transfer enhancement in plate fin heat sink Microelectron. Reliab. 49 2009 163 169
-
(2009)
Microelectron. Reliab.
, vol.49
, pp. 163-169
-
-
Yang, Y.1
Peng, H.2
-
10
-
-
39749179128
-
Transient cooling of electronics using phase change material (PCM)-based heat sinks
-
DOI 10.1016/j.applthermaleng.2007.06.010, PII S1359431107002116
-
R. Kandasamy, X.Q. Wang, and A.S. Mujumdar Transient cooling of electronics using phase change material(PCM)- based heat sinks Appl. Therm. Eng. 28 2008 1047 1057 (Pubitemid 351312692)
-
(2008)
Applied Thermal Engineering
, vol.28
, Issue.8-9
, pp. 1047-1057
-
-
Kandasamy, R.1
Wang, X.-Q.2
Mujumdar, A.S.3
-
11
-
-
79956066350
-
Optimization of size and shape of composite heat sinks with phase change materials
-
C. Balaji, P. Mungara, and P. Sharma Optimization of size and shape of composite heat sinks with phase change materials Heat Mass Transfer 47 2011 597 608
-
(2011)
Heat Mass Transfer
, vol.47
, pp. 597-608
-
-
Balaji, C.1
Mungara, P.2
Sharma, P.3
-
12
-
-
8744262696
-
A hybrid thermal energy storage device, part 1: Design methodology
-
N. Zheng, and R.A. Wirtz A hybrid thermal energy storage device, part 1: design methodology ASME J. Electron. Packag. 126 2004 1 7
-
(2004)
ASME J. Electron. Packag.
, vol.126
, pp. 1-7
-
-
Zheng, N.1
Wirtz, R.A.2
-
13
-
-
2442526167
-
Analysis of a phase change energy storage system for pulsed power dissipation
-
S. Krishnan, and S.V. Garimella Analysis of a phase change energy storage system for pulsed power dissipation IEEE Trans. Compon. Packag. Technol. 27 2004 191 199
-
(2004)
IEEE Trans. Compon. Packag. Technol.
, vol.27
, pp. 191-199
-
-
Krishnan, S.1
Garimella, S.V.2
-
14
-
-
84355161407
-
Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling
-
R. Baby, and C. Balaji Experimental investigations on phase change material based finned heat sinks for electronic equipment cooling Int. J. Heat Mass Transfer 55 2012 1642 1649
-
(2012)
Int. J. Heat Mass Transfer
, vol.55
, pp. 1642-1649
-
-
Baby, R.1
Balaji, C.2
-
15
-
-
0033941794
-
Diffusion within a porous medium with randomly distributed heat sinks
-
DOI 10.1016/S0017-9310(99)00385-3, PII S0017931099003853
-
V.V. Kulish, and J.L. Lage Diffusion within a porous medium with randomly distributed heat sinks Int. J. Heat Mass Transfer 43 2000 3481 3496 (Pubitemid 30480576)
-
(2000)
International Journal of Heat and Mass Transfer
, vol.43
, Issue.18
, pp. 3481-3496
-
-
Kulish, V.V.1
Lage, J.L.2
-
16
-
-
0035811125
-
Paraffin/porous-graphite-matrix composite as a high and constant power thermal storage material
-
DOI 10.1016/S0017-9310(00)00309-4, PII S0017931000003094
-
X. Py, R. Olives, and S. Mauran Paraffin/porous-graphite-matrix composite as a high and constant power thermal storage material Int. J. Heat Mass Transfer 44 2001 2727 2737 (Pubitemid 32494854)
-
(2001)
International Journal of Heat and Mass Transfer
, vol.44
, Issue.14
, pp. 2727-2737
-
-
Py, X.1
Olives, R.2
Mauran, S.3
-
17
-
-
79951512903
-
Experimental investigations on heat transfer in phase change materials (PCMs) embedded in porous materials
-
D. Zhou, and C.Y. Zhao Experimental investigations on heat transfer in phase change materials (PCMs) embedded in porous materials Appl. Therm. Eng. 31 2011 970 977
-
(2011)
Appl. Therm. Eng.
, vol.31
, pp. 970-977
-
-
Zhou, D.1
Zhao, C.Y.2
-
18
-
-
80052077933
-
A numerical investigation of heat transfer in phase change materials (PCMs) embedded in porous metals
-
Y. Tian, and C.T. Zhao A numerical investigation of heat transfer in phase change materials (PCMs) embedded in porous metals Energy 36 2011 5539 5546
-
(2011)
Energy
, vol.36
, pp. 5539-5546
-
-
Tian, Y.1
Zhao, C.T.2
-
19
-
-
84879107377
-
A neural network based optimization of thermal performance of pcm based finned heat sinks-an experimental study
-
R. Baby, and C. Balaji A neural network based optimization of thermal performance of pcm based finned heat sinks-an experimental study Exp. Heat Transfer 26 2013 431 452
-
(2013)
Exp. Heat Transfer
, vol.26
, pp. 431-452
-
-
Baby, R.1
Balaji, C.2
-
21
-
-
84894501444
-
Numerical investigation of PCM based heat sinks with embedded metal foam/crossed plate fins
-
(in press)
-
P.V.S.S. Srivatsa, R. Baby, and C. Balaji Numerical investigation of PCM based heat sinks with embedded metal foam/crossed plate fins Numer. Heat Transfer Part A 2013 (in press)
-
(2013)
Numer. Heat Transfer Part A
-
-
Srivatsa, P.V.S.S.1
Baby, R.2
Balaji, C.3
|