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Volumn 596, Issue , 2014, Pages 158-163
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A study on the electrical and mechanical properties of printed Ag thin films for flexible device application
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Author keywords
Electronic properties; Mechanical properties; Microstructure; Nanostructured materials
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Indexed keywords
ADHESIVES;
ELECTRONIC PROPERTIES;
MECHANICAL PROPERTIES;
METAL NANOPARTICLES;
MICROSTRUCTURE;
NANOSTRUCTURED MATERIALS;
SINTERING;
THIN FILMS;
ADHESIVE STRENGTH;
CLUSTER FORMATIONS;
CRITICAL FACTORS;
ELECTRICAL AND MECHANICAL PROPERTIES;
FLEXIBLE DEVICE APPLICATIONS;
MECHANICAL AND ELECTRICAL PROPERTIES;
MICROSTRUCTURAL ANALYSIS;
POLYIMIDE SUBSTRATE;
SILVER NANOPARTICLES;
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EID: 84894248577
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2014.01.184 Document Type: Article |
Times cited : (20)
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References (31)
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