Direct intense pulsed light sintering of inkjet-printed copper oxide layers within six milliseconds

ACS Applied Materials and Interfaces

Volumn 6, Issue 3, 2014, Pages 1682-1687

  Kang, Hyunkyoo ^a   Sowade, Enrico ^a   Baumann, Reinhard R ^a,b  

^a CHEMNITZ UNIVERSITY OF TECHNOLOGY   (Germany)

^b FRAUNHOFER INSTITUTE FOR ELECTRONIC NANO SYSTEMS ENAS   (Germany)

Author keywords

copper oxide; inkjet printing; intense pulsed light sintering; printed electronics; roll to roll printing

Indexed keywords

EID: 84894160192     PISSN: 19448244     EISSN: 19448252     Source Type: Journal    
DOI: 10.1021/am404581b     Document Type: Article

References (23)

1. Jalkanen, T.; Makila, E.; Maattanen, A.; Tuura, J.; Kaasalainen, M.; Lehto, V.; Ihalainen, P.; Peltonen, J.; Salonen J. Appl. Phys. Lett. 2012, 101 263110
2. Pranonsatit, S.; Worasawate, D.; Sritanavut, P. IEEE Trans. Compon. Packag. Technol. 2012, 2, 878-883
3. Allen, M.; Lee, C.; Ahn, B.; Kololuoma, T.; Shin, K.; Ko, S. Microelectron. Eng. 2011, 88, 3293-3299
4. Skotadis, E.; Tang, J.; Tsouti, V.; Tsoukalas, D. Microelectron. Eng. 2010, 87, 2258-2263
5. Marjanovic, N.; Hammerschmidt, J.; Perelaer, J.; Farnsworth, S.; Rawson, I.; Kus, M.; Yenel, E.; Tilki, S.; Schubert, U. S.; Baumann, R. R. J. Mater. Chem. 2011, 21, 13634-13639
6. Sheats, J. R. J. Mater. Res. 2004, 19, 1974-1989
7. Xu, J. M. Synth. Met. 2000, 115, 1-3
8. Kamyshny, A.; Steinke, J.; Magdassi, S. Open Appl. Phys. J. 2011, 4, 19-36
9. Perelaer, J.; Abbel, R.; Wünscher, S.; Jani, R.; Lammeren, T. V.; Schubert, U. S. Adv. Mater. 2012, 24, 2620-2625
10. Perelaer, J.; Klokkenburg, M.; Hendriks, C. E.; Schubert, U. S. Adv. Mater. 2009, 21, 4830-4834
11. Kang, J. S.; Ryu, J.; Kim, H. S.; Hahn, H. T. J. Electron. Mater. 2011, 40, 2268-2277
12. Perelaer, J.; Jani, R.; Grouchko, M.; Kamyshny, A.; Magdassi, S.; Schubert, U. S. Adv. Mater. 2012, 24, 3993-3998
13. Kim, D.; Moon, J. Electrochem. Solid State 2005, 8, J30-J33
14. Kim, H. S.; Dhage, S. R.; Shim, D. E.; Hahn, H. T. Appl. Phys. A: Mater. Sci. Process. 2009, 97, 791-798
15. Han, W. S.; Hong, J. M.; Kim, H. S.; Song, Y. W. Nanotechnology 2011, 22, 395705
16. Chung, W. H.; Hwang, H. J.; Lee, S. H.; Kim, H. S. Nanotechnology 2013, 24, 035202
17. Reinhold, I.; Müller, M.; Müller, M.; Voit, W.; Zapka, W. Int. Conf. Digital Print. Technol. Digital Fabr. 2011, 424-430
18. Galagana, Y.; Coenen, E. W. C.; Abbel, R.; Lammeren, T. J.; Sabik, S.; Barink, M.; Meinders, E. R.; Andriessen, R.; Blom, P. W. M. Org. Electron. 2013, 14, 38-46
19. Launeau, P.; Archanjo, C. J.; Picard, D.; Arbaret, L.; Robin, P. Y. Tectonophysics 2010, 492, 230-239
20. Schroder, K. A. Nanotechnology 2011, 2, 220-223
21. Deegan, R. D.; Bakajin, O.; Dupont, T. F.; Huber, G.; Nagel, S. R.; Witten, T. A. Nature 1997, 389, 827-829
22. Park, S. H.; Jang, S.; Lee, D. J.; Oh, J.; Kim, H. S. J. Micromech. Microeng. 2013, 23 015013
23. Ryu, J.; Kim, H.-S.; Hahn, H. T. J. Electron. Mater. 2011, 40, 42-50