Optical solder bumps: A modular approach to monolithic optoelectronic integration

2001 International Semiconductor Device Research Symposium, ISDRS 2001 - Proceedings

Volumn , Issue , 2001, Pages 584-588

  Fonstad, C G ^a  

^a Department of Electrical Engineering and Computer Science   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BATCH DATA PROCESSING; MONOLITHIC INTEGRATED CIRCUITS; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICES; SILICON; SILICON COMPOUNDS; SOLDERING; THERMAL EXPANSION; WAFER BONDING;

COMPOUND SEMICONDUCTORS; ECONOMIC ADVANTAGES; HETEROGENEOUS INTEGRATION; MODULAR APPROACH; MONOLITHIC INTEGRATION; OPTOELECTRONIC INTEGRATION; SILICON INTEGRATED CIRCUITS; THERMAL EXPANSION COEFFICIENTS;

SILICON WAFERS;

EID: 84893989280     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISDRS.2001.984585     Document Type: Conference Paper

References (5)

1. C. G. Fonstad, Jr., "Very large scale monolithic heterogeneous optoelectronic integration: the epitaxy-on-electronics, silicon-on-gallium arsenide, and aligned pillar bonding techniques" in Heterogeneous Integration: Proceedings of a Conference held January 25-26, 2000 in San Jose, CA edited by Elias Towe (Critical Reviews of Optical Engineering, Vol. CR76, SPIE Optical Engineering Press, Bellingham, WA, 2000) Chapter 1.
2. J. F. Ahadian., P. T. Vaidyanathan, S. G. Patterson, Y. Royter, D. Mull, G. S. Petrich, W. D Goodhue, S. Prasad, L. A. Kolodziejski, and C. G. Fonstad, Jr., "Practical OEIC's based on monolithic integration of GaAs-InGaP LEDs with commercial GaAs VLSI substrates," IEEE J. Quantum Elect. 34 (1998) 1117-1123.
3. E. K. Braun, K. V. Shenoy, C. G. Fonstad, Jr., and J. M. Mikkelson, "Elevated temperature stability of GaAs digital integrated circuits," IEEE Electron Device Letters, 17 (1996) 37-39.
4. Nanogen, 'www.nanogen.com'
5. Alien Technologies, Inc. 'www.alientechnology.com'.