Fabrication of metal alloy-deposited flexible MWCNT buckypaper for thermoelectric applications

Journal of Nanomaterials

Volumn 2013, Issue , 2013, Pages

  Liu, Jih Hsin ^a   Miao, Hsin Yuan ^a   Lakshmanan, Saravanan ^a   Wang, Li Chih ^a   Tsai, Ren Hui ^a  

^a TUNGHAI UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONDUCTIVITY; FLEXIBLE NETWORKS; HIGH TEMPERATURE; SEMICONDUCTIVITY; THERMAL EVAPORATION METHOD; THERMOELECTRIC; THERMOELECTRIC APPLICATION; THERMOELECTRIC DEVICES;

ALLOYS; ELECTRIC PROPERTIES; SEEBECK COEFFICIENT;

METALS;

EID: 84893853237     PISSN: 16874110     EISSN: 16874129     Source Type: Journal    
DOI: 10.1155/2013/635647     Document Type: Article

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