Nanoflex for neural nanoprobes

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Volumn , Issue , 2013, Pages 1278-1281

  Ledochowitsch, P ^a   Tiefenauer, R F ^a   Pepin, B ^a   Maharbiz, M M ^a   Blanche, T J ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

flex cable; neural interface; parylene; polytrode

Indexed keywords

ACCELERATED LIFETIME TESTING; ELECTROCHEMICAL IMPEDANCE; ENGINEERING CHALLENGES; FLEX CABLES; NEURAL INTERFACES; NEURONAL INTERFACES; PARYLENES; POLYTRODE;

ACTUATORS; BRAIN; MICROSYSTEMS; NANOPROBES; NEURAL NETWORKS; PROBES; SOLID-STATE SENSORS;

CABLES;

EID: 84891695284     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/Transducers.2013.6627009     Document Type: Conference Paper

References (14)

1. J. Du, T. J. Blanche, R. R. Harrison, H. A. Lester, S.C. Masmanidis, PLoS ONE (2011): 6(10).
2. Neuron cc itv Hx64 hybrid hex-cable (hai,://neurnnexustech.c om).
3. C. Marin &E. Fernández. Iron tiers in neuroengineering. (2010) 3. p 8.
4. R. Biran and Tresco. P. A. Journal of Biomed. Materials Revearch Part A. (2007). 82A( I). 169-178.
5. C. Pang and R.A. Andersen. Engineering In Medicine And Biology (2005): p4-7.
6. Q. Bat, K.D. Wise. and D.J. Anderson. IEEE Trani Biomed. Eng. (2000). Vol 47. pp.281-289.
7. J.F. Hetke. J.L. Lund. K.Najahi. K.D. Wise. DJ. Anderson. Biomedical Engineering, IEEE Transactions on (1994). vol.41 no.4.pp.314.321.
8. Stephen Timoshenko, James M. Gere. Mechanics of Materials Van Nostrand Reinhold Co., (1972).
9. B. C. Auman (1995). Fluorinated, Low Theimal Expansion Coefficient Polyimides For Interlayer Dielectric Application: Thermal Stability, Refractive Index And High Temperature Modulus Measurements. MRS Proceedings, 381,19 doi: 10.15 5 7/PROC-3 81-19
10. "SCS Patylene Properties" from http://www.scscoatings.com
11. Roark, Raymond, and Young,Warren, FormulasforStress and Strain, 8 edition,McGraw Hill, 2011.
12. P. Ledochowitsch, R. J. Félus, R. R. Gibboni, A. Miyakawa, A. Bao, and M. M. Maharbi4 in MEMS '11, 2011
13. Wen, D.C. Rodger, E. Men J.D. Weiland, MS. Humayun, T. Yu-Chong, Microel ectromechanical Systems, Journal of vol.19, no.4, pp.735-742, Aug. 2010
14. W. Hubbert, Technical ReportAFML-TR-79-4199, University of Utah, Salt Lake City, 1980 L.